Nuwa TCAD

GMPT, October 2024

Nuwa TCAD uses numerical methods such as finite element and finite volume to solve drift-diffusion equations. It is also used for analyzing the physical mechanisms and electrical and optical properties within semiconductor devices. TCAD simulation software is essential for enhancing the performance, product development efficiency, and yield of semiconductor devices. It is a key tool in designing processes and devices, critical for semiconductor chip manufacturing and integrated circuit design.

Solver List

Solvers are an important component of TCAD simulation software. The solvers in Nuwa TCAD simulation software include:

Drift-diffusion solver
Level set solver
Mechanics solver
Ion diffusion solver
Mesh solver

Model List

The Process Simulation models included in Nuwa TCAD simulation software are as follows:

Process Simulation Models	Deposition Models	Geometric Deposition Models
		Physical Deposition Models	Isotropic Deposition

			PECVD Deposition
			PVD Deposition
	Etching Models	Geometric Etching Models	Segmented Geometric Etching Model
			Polygonal Geometric Etching Model
		Physical Etching Models	Isotropic Etching Model
			Anisotropic Wet Etching Model
			Ion Milling Etching Model
			Reactive-Ion Etching Model
			High-Density Plasma Etching Model
			Deep Reactive-Ion Etching Model
	Ion Implantation Models	Empirical Formulas	Gaussian Model
			Pearson IV Model
			Dual-Pearson Model
		SIMS Doping Distribution Import
		Monte Carlo BCA Model
	Diffusion Models	Constant Model
		Fermi Model
		Charged Fermi Model
		Pair Model
		Charged Pair Model
		React Model
		Charged React Model

The Device Simulation models included in Nuwa TCAD simulation software are as follows:

Device Simulation Models	Material Models	Impact Ionization
		Defects
		Mobility Variation with Temperature, Electric Field, Doping, and Defects
		Wurtzite Materials Polarization, Semi-polar, and Non-polar Models
		Free Carrier Absorption
		Organic Material Characteristics
		4x4/6x6/8x8KP Band Structure Calculation Theories
	Structural Models	Interface Effects	Interface Recombination
			Interface Charge
			Interface Defects
		Tunneling Effects	Intra-band Tunneling
			Inter-band Tunneling
			Defect-assisted Tunneling
	Device Models
		Hot Electron Emission
		ABC Recombination
		Quantum Well Carrier Transport (including Type II)
		EIM, BPM Lateral Mode Solutions
		Longitudinal Mode Solutions
		Optical Injection and Multilayer Film Optical Transmission
		Self-heating and Thermal Transport
		Hot Electron Emission
		AC High-frequency Small Signal Analysis
		FDTD and Ray Tracing
		Mini-band Transport
		Non-equilibrium Green's Function (NEGF)
		Stress and Strain

Output Data Types

Nuwa TCAD simulation software outputs the following data types:

Spatial Distribution of Physical Quantities Inside Devices (1D&2D): Electric field, electric potential, carrier concentration, mobility, photon generation rate, Auger recombination rate, SRH recombination rate, lattice temperature, acceptor and donor concentrations, current density, etc.
Optical and Electrical Output Characteristics (Steady State) I-V curves, stimulated emission spectra, I-P curves, spontaneous emission spectra, laser far-field distribution, etc.
Optical and Electrical Output Characteristics (Transient) Large signal response curves, square wave pulse power curves, laser modulation bandwidth, Smith charts, etc.

Software Features

Easy to Learn and Use: Nuwa TCAD simulation software offers both graphical interface mouse operations and script system operations, making it user-friendly and easy to learn and use.
Customizable Material Library: Users can customize the material library and visually analyze material properties. Additionally, users can add new materials to the library and define their process and device simulation parameter models, facilitating the exploration and development of new materials and device structures.
Rapid Verification: Used in the semiconductor device manufacturing cycle for device simulation and mechanism analysis to develop and optimize processes and devices, rapidly verifying new device structures, thus reducing the number of chip prototypes and development costs.
Integrated Simulation: Supports coordinated simulations through Python scripts, such as combining with Macondo for various optoelectronic device simulations, and flexible data analysis.
Broad Application: Suitable for various microelectronic and optoelectronic device applications, such as power devices, lasers, light-emitting devices, solar cells, and TFTs. It can simulate electrical, thermal, and optical properties, outputting internal distributions like electric potential, electric field, current, and carrier concentration, while supporting steady-state, transient, and small signal analysis.
Multi-Physics Coupling: Capable of handling multi-physics coupling effects, typically including:
- Coupling of electric field, carrier concentration with stress and mobility
- Coupling of interface and bulk traps (single level, exponential, and Gaussian), and Poisson's equation
- Coupling of electric field, temperature, stress with material bandgap
- Coupling of electric field and incomplete ionization of carriers
- Coupling of carrier quantum and non-local behaviors such as tunneling, hopping, and thermal excitation with drift-diffusion behavior
- Coupling of light intensity with semiconductor material internal and interface traps (single level, exponential, and Gaussian)
- Coupling of temperature, carrier injection, stress with changes in refractive index and light mode and effective refractive rate
- Coupling of semiconductor heterostructure thermal equilibrium equations and drift-diffusion equations
- Arbitrary coupling among metal/semiconductor/insulator
- Coupling of transient optical injection and time-dependent carrier transport